Spike & Profile Temperature Sensors — Furnace Profiling · Semiconductor · Heat Treat

Spike and Profile Sensor Insertion Style

Spike and profile work often starts with the physical insertion style. Pointed probe geometry supports compact push-through measurement for process validation, profile checks, and localized internal temperature readings.

Profile & Spike Sensor Types

Push-Through Spike Thermocouple

A pointed-tip MIMS thermocouple is designed to be pushed through foam, PCB, food product, or other materials to measure internal temperature during a process cycle. It uses an exposed or lightly insulated tip, a MIMS body, and a miniature thermocouple connector. It is used for thermal validation of reflow ovens, wave solder machines, conformal coating ovens, and food pasteurization tunnels.

Furnace Survey Thermocouple

Survey thermocouples are used for AMS 2750 Temperature Uniformity Surveys (TUS) and System Accuracy Tests (SAT). Type K, N, or noble-metal R/S constructions are selected according to AMS 2750 Tables 1 and 2. Bayonet or compression fittings make installation easier at survey grid points. A NIST-traceable calibration certificate is required for each survey element.

Semiconductor Wafer Profile RTD

Pt100 profile sensors are used for semiconductor diffusion furnace tube temperature mapping. These builds use a small-OD 316 stainless steel or quartz-sheathed probe with multiple calibrated elements at defined depths, compatible with 200 mm and 300 mm wafer tube access ports. Class A, 4-wire construction is available with NIST-traceable multipoint calibration at process temperatures.

Survey Thermocouple Requirements

Calibration Certificate Requirements

AMS 2750 and CQI-9 require that all survey thermocouples have a current NIST-traceable calibration certificate documenting the actual error at calibration temperature(s). Thermometrics issues calibration certificates with every thermal-profile survey assembly. Certificates include sensor serial number, calibration date, reference standard traceability chain, and individual junction error at all test points. Recalibration service is available on returned assemblies.